Sescoi and partners will be demonstrating our software solutions at the events listed below.  Our sales partners may also be exhibiting at a show in your territory not yet listed below.

Contact us for details of an upcoming event near you.

	Ingersoll Die & Mold Seminar, Rockford, IL, USA, 6-7 August 2008 www.ingersoll-imc.com/en/seminars/index.htm
	Taipei International Mold & Die Industry Fair, Taiwan, 21-24 August 2008 www.odm-dmi.com/en/
	IMTS, Chicago, IL, 8-13 September 2008 www.imts.com
	AMB, Stuttgart, Germany, 9-13 September 2008 www.messe-stuttgart.de/amb/2008/english/index.htm
	MSV, Brno, Czech Republic, 15-19 September 2008 www.bvv.cz/msv-gb
	Aria, Chambery, France, 25-27 September 2008 www.aria-cadcam.com
	DMS Kansai, Japan, 1-3 October 2008 www.dms-kansai.jp/english/
	Mecatronic Online Exhibition, France, 13-18 October 2008 www.mecatronicexpo.com
	SIANE, Toulouse, France, 14-16 October 2008 www.salonsiane.com
	TCT Exhibition, Coventry, UK, 21-22 October 2008 www.time-compression.com/x/exhibition.html
	DTMA, Dayton, USA, 22-23 October 2008 www.dtma.org
	Jimtof 2008, Tokyo, 30 Oct-5 November 2008 www.jimtof.org/eng/index.html
	Airtec, Frankfurt, Germany, 11-14 November 2008 www.airtec.aero/english/the-airtec/index.html
	EMAF, Oporto, Portugal, 12-15 November 2008 emaf.exponor.pt/Páginainicial/tabid/53/Default.aspx
	Euromold, Frankfurt, Germany, 3-6 December 2008 www.euromold.com/english/index.php
	SEPEM, Douai, France, 27-29 January 2009 www.sepem-industries.com
	Industrie, Lyon, France 10-13 March 2009 www.industrie-expo.com
	FIP, Lyon, France, 16-19 June 2009 www.f-i-p.com